Advantages and disadvantages of SMD, COB and GOB in LED packaging technology

 In the packaging technology of small-pitch LED displays , SMD, COB and GOB each have their own advantages and disadvantages. The following is a detailed analysis of these technologies:

SMD (Surface Mounted Devices) surface mount process technology

SMD technology is a mature technology for soldering LED lamp beads on circuit boards and is widely used in LED displays. What is an SMD LED display What is a DIP LED display?

Advantages:

Mature technology: SMD technology is very mature and the production process is stable.

Low manufacturing cost: Due to mature technology, the production cost is relatively low.

Good heat dissipation effect: Reasonable design and excellent heat dissipation performance.

Easy maintenance: When problems occur, maintenance is relatively convenient.

Disadvantages:

Low protection level: It does not have moisture-proof, waterproof, dust-proof, shock-proof, and collision-proof functions.

Great harm to eyes: long-term viewing will cause glare, fatigue and other problems, and there are blue light hazards.

Short life of LED lamps: greatly affected by environmental factors, shortened service life.

Mask problem: SMD screens using masks are prone to bulging at high temperatures, and the mask turns white or yellow after long-term use, affecting the viewing effect.


COB (Chips on Board) packaging technology

COB technology directly adheres the bare chip to the interconnect substrate, and then wire bonds and encapsulates it. COB LED display: Exploring novel display technology.

Advantages:

Space saving: more compact display screens can be made.

Excellent thermal management: efficient thermal management method.

High light quality: can provide high-quality light effect.

Wide application: has advantages in production efficiency and low thermal resistance.



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